Rogers DiClad 527 DK2.40-2.60 Df0.0017 (0.020-0.060") PTFE/Woven Fiberglass Laminate
Brief Introduction
DiClad series laminates are woven fiberglass/PTFE composite materials used as printed circuit board substrates. DiClad 527 utilizes a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates, along with improved dimensional stability and lower thermal expansion in all directions. The coated fiberglass plies are aligned in the same direction, ensuring consistent performance.
Technical Features & Benefits
Woven fiberglass reinforcement for greater dimensional stability.
Precise control of fiberglass/PTFE ratio.
Better dielectric constant uniformity than comparable non-woven laminates.
Low thermal expansion in X, Y, and Z directions.
Excellent mechanical strength and peel strength.
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Typical Properties: DiClad 527
| Property |
Test Method |
Condition |
DiClad 527 |
| Electrical Properties | | | |
| Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | 23˚C @ 50% RH | 2.40-2.60 |
| Dielectric Constant @ 1 MHz | IPC TM-650 2.5.5.3 | 23˚C @ 50% RH | 2.40-2.60 |
| Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | 23˚C @ 50% RH | 0.0017 |
| Dissipation Factor @ 1 MHz | IPC TM-650 2.5.5.3 | 23˚C @ 50% RH | 0.0010 |
| Thermal Coefficient of Dk (ppm/˚C) | IPC TM-650 2.5.5.5 Adapted | -10 to 140˚C | -153 |
| Volume Resistivity (MΩ·cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.2 x 10⁹ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 4.5 x 10⁷ |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Arc Resistance | ASTM D-495 | - | >180 |
| Thermal Properties | | | |
| Coefficient of Thermal Expansion - X (ppm/˚C) | IPC TM-650 2.4.41 | 50˚C to 150˚C | 14 |
| Coefficient of Thermal Expansion - Y (ppm/˚C) | IPC TM-650 2.4.41 | 50˚C to 150˚C | 21 |
| Coefficient of Thermal Expansion - Z (ppm/˚C) | IPC TM-650 2.4.24 | 50˚C to 150˚C | 173 |
| Thermal Conductivity (W/(m·K)) | ASTM E1461 | - | 0.26 |
| Mechanical Properties | | | |
| Copper Peel Strength (lbs/in) | IPC TM-650 2.4.8 | 10s @ 288˚C, 35 µm foil | 14 |
| Young's Modulus (kpsi) | ASTM D-638 | 23˚C @ 50% RH | 517, 706 |
| Tensile Strength (MD, CMD) (kpsi) | ASTM D-882 | 23˚C @ 50% RH | 19.0, 15.0 |
| Compressive Modulus (kpsi) | ASTM D-695 | 23˚C @ 50% RH | 359 |
| Flex Modulus (kpsi) | ASTM D-3039 | 23˚C @ 50% RH | 537 |
| Physical Properties | | | |
| Flammability | UL 94 | C48/23/50 & C168/70 | V-0 |
| Moisture Absorption (%) | IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.03 |
| Density (g/cm³) | ASTM D792 Method A | C24/23/50 | 2.31 |
| NASA Outgassing | | | |
| Total Mass Lost (%) | NASA SP-R-0022A | 125°C, ≤ 10⁻⁶ torr | 0.02 |
| Collected Volatiles (%) | NASA SP-R-0022A | 125°C, ≤ 10⁻⁶ torr | 0.00 |
| Water Vapor Recovered (%) | NASA SP-R-0022A | 125°C, ≤ 10⁻⁶ torr | 0.01 |
Application Areas
Filters, Couplers, Low Noise Amplifiers (LNAs)
Power Dividers and Combiners
Applications where dielectric constant uniformity and low loss are critical.
Available Configurations
Standard Thicknesses:
0.020" (0.508 mm) +/- 0.0020"
0.030" (0.762 mm) +/- 0.0020"
0.060" (1.524 mm) +/- 0.0020"
Standard Panel Sizes:
12" x 18" (305 x 457 mm)
18" x 12" (457 x 305 mm)
18" x 24" (457 x 610 mm)
24" x 18" (610 x 457 mm)
Standard Claddings:
Electrodeposited Copper Foil: ½ oz. (18 µm), 1 oz. (35 µm)
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